Labels Milestones
Back(Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body.
- Case 28.6x28.6mm, pitch 18.0mm.
- (end 166.8125 79.25 (end 156.63 117.37 (end.
- Pot, an LED, and.
- 16x16 grid, 17x17mm package, 0.8mm pitch.