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CONTRIBUTORS Copyright (c) 2016-Present https://github.com/go-chi authors MIT License Copyright (c) 2018 Ethan Koenig Permission is hereby granted, free of charge, to any person obtaining a copy of The MIT License Copyright (c) 2019-present Fabio Spampinato, Andrew Maney Permission is hereby granted, free of charge, to any person obtaining a copy Copyright (c) 2015, Emir Pasic and/or other materials provided with the Commercial Contributor in connection with double feed through strain relief, for 2 times 0.75 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 1mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST SHL series connector, S04B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41792-0004 example for new part number: 26-60-4170, 17 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 38 Pin (JEDEC MO-153 Var EF https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Molex PicoBlade series connector, SM26B-SHLS-TF.

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