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BackLongPads 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils 6-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations variant of 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (JEDEC MO-153 Var CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator JST XH series connector, 501331-1407 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, B14B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0403-5-51, 3 Pins per row.
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