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CA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (http://www.issi.com/WW/pdf/31FL3736.pdf#page=28), generated with kicad-footprint-generator Mounting Hardware, external M3, height 11, Wuerth electronics 9771090360 (https://katalog.we-online.com/em/datasheet/9771090360.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 16 Pin (https://www.nxp.com/docs/en/package-information/SOT758-1.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xxx-DV, 40 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose series connector, 502585-0670 (http://www.molex.com/pdm_docs/sd/5025850270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.5x2.5mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.8mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf UFBGA-132, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/tps63000.pdf 3x3mm Body, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted socket strip THT 1x23 1.27mm single row style2 pin1 right Through hole angled pin header, 2x13, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 2x03 1.27mm double row surface-mounted straight pin header, 2x26, 2.54mm pitch, 6mm pin length, single row Through hole socket strip SMD 2x05 2.00mm double row Through hole pin header SMD 1x24 2.00mm single row Through hole IDC header, 2x32, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted pin header THT 2x07 1.00mm double row surface-mounted straight socket strip, 2x34, 2.00mm pitch, double rows Surface mounted socket strip THT 1x15 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x25 1.00mm single row style2 pin1 right Through hole straight socket strip, 1x37, 1.27mm pitch, 4.0mm pin length, single row Surface mounted socket strip SMD 1x29 1.00mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x32 2.00mm double row Through hole pin header THT 1x36 1.00mm single row Through hole pin header THT 2x08 2.54mm double row Through hole angled pin header, 2x15, 2.54mm pitch, single row Through hole IDC box header, 2x30, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x12 2.54mm double row surface-mounted straight socket strip, 2x15, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole socket strip SMD 1x21 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip.

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