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Angle stacked dual USB 3.0, type A, right angle stacked dual USB 3.0, type A, Horizontal, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=292303&DocType=Customer+Drawing&DocLang=English USB A connector https://www.we-online.com/catalog/datasheet/614004134726.pdf Stacked USB A connector http://katalog.we-online.de/em/datasheet/61400826021.pdf A,phenol MUSB_D511, USB B receptable with flange, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10118193.pdf USB Micro-B receptacle, horizontal, SMD, 10118193, without flange, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10118193.pdf USB Micro-B receptacle, http://www.mouser.com/ds/2/445/629105150521-469306.pdf USB Mini-B 5-pin SMD connector, http://downloads.lumberg.com/datenblaetter/en/2486_01.pdf USB USB_B USB_micro USB_OTG USB Micro-B, right-angle, SMT, https://datasheet.lcsc.com/szlcsc/1811141824_XKB-Enterprise-U262-161N-4BVC11_C319148.pdf Micro USB AB receptable, right-angle inverted (https://www.molex.com/pdm_docs/sd/475900001_sd.pdf Micro AB USB SMD Type-A Receptacle Right Angle Low-profile vertical USB 2.0 Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with Korean HRO Parts Elec TYPE-C-31-G-06 USB Type-C 3.0 Receptacle, 24-pin, right angle smd HDMI, Micro, Type D, THT/SMD hybrid, 0.4mm pitch, 19 ckt, right angle (https://www.we-online.com/katalog/datasheet/692122030100.pdf USB 3.0 Micro B horizontal dustproof waterproof IP67 XKB Connectivity, USB Micro-B, horizontal, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104110.pdf USB Micro B horizontal dustproof waterproof IP67 XKB Connectivity, USB Micro-B, horizontal, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10104110.pdf USB Micro B horizontal USB Micro-B Receptacle SMD Wire Pad, Square, SMD Pad, 5mm x 10mm, MesurementPoint Square SMDPad 5mmx10mm Wuerth WR-WTB series connector, DF3EA-05P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing&lang=en&documentid=0001163317), generated with kicad-footprint-generator Tantalum Capacitor SMD 0402 (1005 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator JST XH series connector, B03B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 1.5 mm² wires, reinforced insulation, conductor diameter 0.65mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex LY 20 series connector, 505405-1470 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, DF52-15S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator JST PH series connector, B10B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN8 2x2, 0.5P (https://www.onsemi.com/pub/Collateral/511AT.PDF On Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS711-Datasheet.ashx Allegro Microsystems PSOF-7, 4.8x6.4mm Body, 1.60mm Pitch (http://www.allegromicro.com/~/media/Files/Datasheets/ACS780-Datasheet.ashx Allegro Microsystems 24-Lead Plastic QFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology 05081733_A_DF12.pdf DFN12, 4x4, 0.65P; CASE 506CE (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic PSOP, Exposed Die Pad (see https://www.diodes.com/assets/Datasheets/AP2204.pdf SSOP 0.50 exposed pad 4.5x7mm (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-20-71/ Infineon SO package 20pin without exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin Placed - Wide, 7.50 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package - 9x9 mm Body [QFN] with thermal vias in pads, 4 Pins per row (https://www.hirose.com/product/document?clcode=CL0537-0834-6-81&productname=DF12E(3.0)-50DP-0.5V(81)&series=DF12&documenttype=2DDrawing&lang=en&documentid=0000992393), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 24 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp_24_14.pdf), generated.

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