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10x10 raster, 9x9mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, VQFN-HR RNN0018A (http://www.ti.com/lit/ds/symlink/tps568215.pdf QFN, 16 Pin (JEDEC MO-153 Var DD-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated.

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