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SMD AVX-M (7260-20 Metric), IPC_7351 nominal, (Body size from: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-119-02-xxx-DV-A, 19 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator Molex Picoflex Ribbon-Cable Connectors, 90814-0014, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 11, Wuerth electronics 9774030482 (https://katalog.we-online.de/em/datasheet/9774030482.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-20S-0.5SH, 20 Pins (http://www.molex.com/pdm_docs/sd/529910308_sd.pdf), generated with kicad-footprint-generator connector JST GH series connector, B3P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0610, with PCB trace layout created pull request synth_mages/MK_VCO#5 Final revision; added custom DRC as project file c4e1c30b9b Add jlc constraints DRC; replace order number text 613d1b6f7ef8de710893bbeb40d56c8d26d50247 @circuitlocution.com created pull request synth_mages/MK_VCO#1 cfb5bfb128 Finish schematic, add PDF Fix for component clearance, panel thickness from printer Binary files /dev/null and b/Images/PXL_20210831_002553634.jpg differ Binary files /dev/null and b/Schematics/Luthers_Perfboard.pdf differ Binary files /dev/null and b/Panels/luther_triangle_vco_quentin_v3_only_art.stl differ Binary files /dev/null and b/Images/captest.png differ Update Panel Style Guide Pages Fab Plant Research Table of Contents Near Future Sequencer MK's 5-step sequencer, expanded to 8 (or 10?) Bergman's 10-step sequencer (AKA Baby10 Outputs synchronized pitch and gate CV between 1 and 2 connected via insulated copper area below body, vias included (case drawing: https://ww2.minicircuits.com/case_style/CD542.pdf, land pattern PL-035, including GND-vias (https://www.minicircuits.com/pcb/98-pl258.pdf Footprint for mini circuit case CD542, Land pattern PL-225, vias included, (case drawing: https://ww2.minicircuits.com/case_style/CD542.pdf, land pattern PL-230, including GND vias (https://ww2.minicircuits.com/pcb/98-pl079.pdf Footprint for Mini-Circuits case HQ1157 (https://www.minicircuits.com/case_style/HQ1157.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf) using land-pattern PL-049, including GND-connections and vias (https://ww2.minicircuits.com/pcb/98-pl049.pdf Ai.

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