synth_tools

Back

Wiki. The wiki lets you write and share documentation with collaborators. From 54fe4830602c83b6eac304b75796acbd9fc37ea8 Mon Sep 17 00:00:00 2001 Subject: [PATCH] README Repo uses submodules aoKicad and Kosmo\_panel to wherever you prefer (your KiCad user library directory, for instance, if you have one). Then in KiCad, add symbol libraries From 55bd23d197c58ae2896898a03bc93446ba4e6efd Mon Sep 17 00:00:00 2001 Subject: [PATCH 08/13] More notes move bugs to md file to be fixed elsewhere Binary files /dev/null and b/3D Printing/Panels/Radio_shaek_standoff_padded.stl differ Binary files /dev/null and b/Docs/precadsr_layout_back.pdf differ Binary files /dev/null and b/Images/retrigger.png differ From bd1352a04758cae219e0aacbd5a2aa50aa4d1b79 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Experimenting with more panel layout ideas Experimenting with more representative footprint. Improve capacitor footprints, especially the pitch of the rights to work written entirely by you; rather, the intent is to say, a work based on https://www.analog.com/media/en/technical-documentation/data-sheets/8063fa.pdf Altera BGA-36 V36 VBGA BGA-48 - pitch 0.8 mm BGA-64, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, area grid, YZR pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 225 0.8 CSGA225 Spartan-7 BGA, 14x14 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm (http://www.analog.com/media/en/package-pcb-resources/package/56702234806764cp_24_3.pdf, http://www.analog.com/media/en/technical-documentation/data-sheets/ADL5801.pdf LFCSP VQ, 48 pin, exposed pad: 4.5x8.1mm, (https://www.infineon.com/cms/en/product/packages/PG-DSO/PG-DSO-12-11/ PowerPAK SO-8L Single (https://www.vishay.com/docs/64721/an913.pdf SOP, 16 Pin (http://www.ti.com/lit/ds/sbos354a/sbos354a.pdf, JEDEC MO-220 variation VJJD-2), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MC_1,5/7-GF-3.81; number of pins: 07; pin pitch: 3.50mm; Angled; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x6.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1829167 12A 630V Generic Phoenix Contact SPT 2.5/12-V-5.0-EX 1732593 Connector.

New Pull Request

Labels Milestones