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48-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 16-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 32-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD DIP Switch SPST Slide 8.61mm 338mil SMD SMD 1x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), Socket 18-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 6-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD DIP Switch SPST Slide 7.62mm 300mil PowerIntegrations variant of 8-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm.

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