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Pitch DDB Package; 8-Lead Plastic Dual Flat, No Lead Package (ML) - 8x8x0.9 mm Body [HTSSOP], with thermal vias; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 10.3.

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