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SMD 5x-dip-switch SPST CTS_Series194-5MSTN, Piano, row spacing 15.24 mm (600 mils), Socket THT DIP DIL ZIF 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (3mm x 2mm) (see Linear Technology DFN_8_05-08-1702.pdf 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20)), generated with kicad-footprint-generator connector Molex Sabre Power Connector, 43160-0104, With thermal vias in pads, 2 Pins per row (http://www.molex.com/pdm_docs/sd/431605304_sd.pdf), generated with kicad-footprint-generator Molex JAE 0.2mm pitch, 1mm overall height FFC/FPC connector, FH12-19S-0.5SH, 19 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WQFN-20 4.5mm 2.5mm 0.5mm WQFN, 20 Pin (http://www.ti.com/lit/ds/symlink/opa569.pdf, http://www.ti.com/lit/an/slma004b/slma004b.pdf), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2791, 27 Circuits (http://www.molex.com/pdm_docs/sd/5022502791_sd.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-174 , 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 44-Lead Plastic Quad Flat, No Lead Package (8E) - 4x4x0.9 mm Body [DFN] (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 8-Lead Plastic DFN (7mm x 4mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic Shrink Small Outline Package (MS) [MSOP], variant of 8-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 12x-dip-switch SPST CTS_Series194-12MSTN, Piano, row spacing 10.16 mm (400 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 8x-dip-switch SPST Omron_A6H-8101, Slide, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils DIL.

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