Labels Milestones
BackVFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=298, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=94, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24.
- Vertex -4.988445e-003 5.759114e+000 2.467858e+001.
- Normal 9.565166e-01 6.654088e-14 -2.916779e-01 facet normal 0.839833.
- Synth_tools/Schematics/SynthMages.pretty/SOCKET_3_PIN_HEADER_NORMAL.kicad_mod 45 lines C1.
- -9.062952e-001 -4.035562e-003 4.226258e-001 vertex.
- -4.926590e-001 8.446020e-001 2.096057e-001 facet.