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Pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ds/symlink/msp430f2234.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=301, NSMD pad definition Appendix A BGA 1924 1 FL1925 FLG1925 FL1926 FLG1926 FL1928 FLG1928 FL1930 FLG1930 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=305, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD 2x20 1.27mm double row Through hole angled socket strip THT 2x12 2.00mm double row surface-mounted straight pin header, 2x25, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 1x12, 2.00mm pitch, 4.2mm pin length, double cols (from Kicad 4.0.7), script generated Through hole vertical IDC box header, 2x12, 2.54mm pitch, double rows Through hole angled socket strip THT 2x06 1.27mm double row surface-mounted straight pin header, 1x26, 2.54mm pitch, double rows Through hole angled socket strip, 1x25, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7.

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