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Size 26.5x15mm^2, drill diamater 1.3mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 4, Wuerth electronics 9775051360 (https://katalog.we-online.com/em/datasheet/9775051360.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-113-02-xxx-DV-BE-LC, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-122-02-xx-DV-TE, 22 Pins (http://www.molex.com/pdm_docs/sd/547220804_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Micro Leadframe Package, 16 pin with exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin Placed - Wide, 5.3 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 1156 1 FF1156 FFG1156 FFV1156 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=275, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole straight socket strip, 1x04, 1.27mm pitch, double rows Through hole angled pin header, 1x40, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip THT 2x06 1.27mm double row surface-mounted straight pin header, 1x35, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header, 2x14, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x02, 2.54mm pitch, 8.51mm socket length, double rows latches, mounting holes, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 1x02 1.00mm single row style2 pin1 right Through hole pin header SMD 1x23 2.54mm single row Through hole socket strip THT 1x25 1.27mm single row Surface mounted pin header THT 1x09 2.54mm single row Through hole IDC header, 2x10, 2.54mm pitch, 8.51mm socket length, double rows Through hole pin header SMD 1x36 1.27mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole angled pin header THT 2x12 2.54mm double row Through hole socket strip SMD 1x36 2.54mm single row Through hole pin header THT 1x21 2.54mm single row Through.

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