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Socket 6-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 18-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 32-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket LongPads 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET L6 MOSFET Infineon PLCC, 20 pins, single row style1 pin1 left Surface mounted socket strip THT 1x01 1.00mm single row Through hole straight pin header, 2x28, 1.27mm pitch, 4.4mm socket length, single row style1 pin1 left Surface mounted socket strip SMD 1x35 1.00mm single row style2 pin1 right Through hole angled pin header, 2x02, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header SMD 1x15 1.00mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x03 1.00mm single row (from Kicad 4.0.7), script generated Through hole straight Samtec HPM power header series.

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