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Module, http://www.hoperf.com/upload/rf/RFM69HW-V1.3.pdf 8 pin DIP socket | | | | | | | | | | | | J2 | 1 | 4.7 uF | Unpolarized capacitor | | | | Tayda | A-805 | | | J7 | 1 | Conn_01x07 | *(optional) SIP socket, 2.54 mm, 1x4 | | | | J4 | 1 | 1 | 2_pin_Molex_header | 2 pin 0.6x1mm 0.375mm height package, https://www.ti.com/lit/ml/mpss034c/mpss034c.pdf, https://www.ti.com/lit/ds/symlink/tpd6e05u06.pdf USON, 14 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0137.PDF (T1433-2C)), generated with kicad-footprint-generator ipc_noLead_generator.py VLGA, 4 Pin (https://www.onsemi.com/pub/Collateral/MDB8S-D.PDF#page=4), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0014 example for new part number: A-41791-0005 example for new part number: 26-60-5150, 15 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF (T2044-2)), generated with StandardBox.py.

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