Labels Milestones
BackLevel chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 1760 1.
- -8.242446e-001 -5.662339e-001 0.000000e+000 vertex 4.575243e+000 -3.392458e+000 9.983999e+000.
- Quentin Normal file View File.
- 4.792337e-001 8.386590e-001 2.588168e-001 facet.
- Normal -9.964592e-01 -8.406732e-02 1.348105e-03 vertex -1.045318e+02 9.809589e+01 1.855000e+01.
- 2.253509e-01 vertex -1.042817e+02 9.665134e+01 1.034656e+01 facet.