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Surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads.

• 6.132856e-001 7.071065e-001 vertex -4.289604e+000 -3.446705e+000 2.484855e+001 facet normal.
• 734-178 , 18 Pins per.
• PCB added the once through idea.
• FF1157 FFG1157 FFV1157 FF1158 FFG1158.
• -0.678283 0.205751 0.705407 facet normal.

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