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9774035243 (https://katalog.we-online.de/em/datasheet/9774035243.pdf), generated with kicad-footprint-generator Inductor SMD Wuerth WE-DD TypL TypXL TypXXL Shielded Coupled Inductor, Wuerth Elektronik, Wuerth_MAPI-1610, 1.6mmx1.6mm Inductor, Wuerth Elektronik, Wuerth_MAPI-4020, 4.0mmx4.0mm Inductor, Taiyo Yuden, NR series, Taiyo-Yuden_NR-30xx, 3.0mmx3.0mm Inductor, Wuerth Elektronik, Wuerth_HCM-7050, 7.2mmx7.0mm Inductor, Wuerth Elektronik, WE-PD2, SMD, Typ LS, Handsoldering, https://katalog.we-online.com/pbs/datasheet/7447715906.pdf Shielded Power Inductor WE-PDF Wuerth Shielded Power Inductor WE-PD2 TypL Wuerth Power Inductor, Wuerth Elektronik, WE-PDF, SMD, Handsoldering, NF-Reansformer ETAL P3000 SMD NF-Reansformer, ETAL, P3000, SMD, Handsoldering, NF-Reansformer ETAL P3000 SMD Handsoldering NF-Transformer, ETAL, P3188, SMD, NF-Transformer ETAL P3188 SMD NF-Transformer, ETAL, P3181, SMD, Hand Soldering, http://www.vishay.com/docs/85597/bzm55.pdf Diode Mini-MELF (SOD-80) Handsoldering Microsemi Powermite 2 SMD power inductor, 10.0x9.0x5.4mm, https://www.tme.eu/Document/bda580f72a60a2225c2f6576c2740ae1/dlg-0504.pdf Inductor, Murata, LQH2MCN_02 series, 1.6x2.0x0.9mm (https://search.murata.co.jp/Ceramy/image/img/P02/JELF243A-0053.pdf chip coil inductor wurth we cair Semi-Shielded High Saturation Power Inductor, SMS-ME3015, Fixed inductor, SMD, https://neosid.de/import-data/product-pdf/neoFestind_SMPIC0612H.pdf Neosid Power Inductor SMD, Coilcraft LPS5030, https://www.coilcraft.com/pdfs/lps5030.pdf, StepUp generated footprint, https://www.infineon.com/cms/en/product/packages/PG-LLGA/PG-LLGA-5-1/ AKM Current Sensor, 7 pin, SMD (http://www.akm.com/akm/en/file/datasheet/CQ-236B.pdf akm current sensor smd AKM VSOP-24 current sensor, 5.6x7.9mm body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 14-Lead Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic Dual Flat, No Lead Package (MR) - 9x9x0.9 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Shrink Small Outline Narrow Body (QR)-.150" Body [QSOP] (see Microchip Packaging Specification 00000049BS.pdf, http://www.onsemi.com/pub/Collateral/NCP1207B.PDF 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with missing pin 5, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads 42-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x19.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST Omron_A6S-610x, Slide, row spacing 7.62 mm (300 mils), body size 10.8x4.1mm DIP Switch SPST Slide 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket.

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