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Angle (source: https://www.cnctech.us/pdfs/C-ARA1-AK512.pdf USB C Type-C Receptacle SMD USB Micro-B receptacle, horizontal, SMD, 10118193, without flange, https://cdn.amphenol-icc.com/media/wysiwyg/files/drawing/10118193.pdf Dustproof Micro USB Type C, right-angle, SMT, https://datasheet.lcsc.com/lcsc/2206091745_XKB-Connectivity-U254-051T-4BH83-F1S_C397452.pdf USB Micro-B receptacle, http://www.mouser.com/ds/2/445/629105150521-469306.pdf USB Mini-B 5-pin SMD connector, http://downloads.lumberg.com/datenblaetter/en/2486_01.pdf USB USB_B USB_Mini connector usb mini receptacle vertical USB Micro-B horizontal SMD GCT Micro USB https://gct.co/files/drawings/usb3076.pdf Micro-USB SMD Typ-B Vertical Molex Vertical Micro USB https://gct.co/files/drawings/usb3076.pdf Micro-USB SMD Typ-B GCT Molex Vertical Micro USB B receptable with flange, bottom-mount, SMD, right-angle (http://www.molex.com/pdm_docs/sd/473460001_sd.pdf Micro B horizontal SMD GCT Micro USB https://gct.co/files/drawings/usb3076.pdf Micro-USB SMD Typ-B Vertical Molex Vertical Micro USB Type C, right-angle, SMT, https://datasheet.lcsc.com/szlcsc/1811141824_XKB-Enterprise-U262-161N-4BVC11_C319148.pdf Micro USB Type C Plug Shenzhen Jing Tuo Jin Electronics Co 918-118A2021Y40002 ( https://datasheet.lcsc.com/lcsc/1912111437_Jing-Extension-of-the-Electronic-Co--918-118A2021Y40002_C399939.pdf ) also compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small Outline Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 5-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 32-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 48-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 48-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 22-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL ZIF 10.16mm 400mil SMDSocket SmallPads 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 20-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 10.8x26.96mm 10x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 3x-dip-switch SPST Copal_CVS-03xB, Slide, row.

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