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5.475mm SOT-93 TO-218-3, Horizontal, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-7 Horizontal RM 5.475mm SOT-93 TO-218-3, Horizontal, RM 1.7mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Vertical RM 4.58mm IPAK TO-251-3, Vertical, RM 10.9mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 2.286mm SIPAK Vertical RM 1.27mm MultiwattF-15 staggered type-1 TO-220F-11, Vertical, RM 1.7mm, IIPAK, I2PAK, see http://pdf.datasheetcatalog.com/datasheet/irf/iris4011.pdf TO-262-5 Vertical RM 2.54mm TO-220-4, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 5.45mm TO-3P-3, Vertical, RM 2.54mm, IIPAK, I2PAK, see http://www.onsemi.com/pub/Collateral/EN8586-D.PDF TO-262-3 Vertical RM 2.54mm staggered type-2 TO-220-5, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 10.16mm 400mil 4-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST , Slide, row spacing 8.9 mm (350 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD, JPin SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 8.89 mm (350 mils), body size 6.7x11.72mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST Omron_A6H-2101, Slide, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads THT DIP DIL ZIF 25.4mm 1000mil Socket 40-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm.

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