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Package (MS) [MSOP], variant of 8-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x12.34mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 3x-dip-switch SPST , Slide, row spacing 5.08 mm (200 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 7x-dip-switch SPST Omron_A6S-710x, Slide, row spacing 7.62 mm (300 mils), missing pin 6 8-lead though-hole mounted high-volatge DIP package (based on http://www.latticesemi.com/view_document?document_id=213.

7.071062e-001 vertex 3.439994e+000 3.872894e+000 2.484855e+001 facet normal -7.1217e-06.
Gate out (j4/j10) // clock in (j2/j11.
0.851405 -0.301701 0.429052 facet normal 0.0942884 -0.991507 0.0895734.
-0.828628 -0.0822158 0.55373 facet normal -0.0925097.
0.830226 facet normal -0.0727061 0.0568312 0.995733 vertex.

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