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TO-3P-3, Vertical, RM 1.27mm, MultiwattF-15, staggered type-2 TO-220F-9, Vertical, RM 5.45mm, see https://www.fairchildsemi.com/package-drawings/TO/TO264A03.pdf TO-264-3 Vertical RM 1.7mm PentawattF- MultiwattF-5 TO-220F-7, Vertical, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Vertical RM 2.54mm TO-220F-4, Horizontal, RM 2.54mm TO-247-5, Horizontal, RM 2.54mm, staggered type-2 TO-220-11, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-9, Horizontal, RM 2.29mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-2 Horizontal RM 1.7mm MultiwattF-11 staggered type-1 TO-220-11, Horizontal, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 5.08mm 2.54 4-lead dip package for diode bridges, row spacing 7.62 mm (300 mils), Socket 20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 4x-dip-switch SPST Copal_CHS-04A, Slide, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 42-pin zero insertion force socket, through-hole, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 64-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 1x-dip-switch SPST , Slide, row spacing 5.25 mm (206 mils), body size 6.7x24.42mm (see e.g. Http://www.ti.com/lit/ds/symlink/drv5023.pdf TO-92L leads in-line (large body variant of 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 11x-dip-switch SPST , Slide, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 8-Lead, 300\" Wide, Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89009xx, 9 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator JST PUD series connector, DF3EA-02P-2H (https://www.hirose.com/product/document?clcode=CL0543-0332-0-51&productname=DF3EA-5P-2H(51)&series=DF3&documenttype=2DDrawing⟨=en&documentid=0001163317), generated with kicad-footprint-generator JST XH series connector, B7B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST VH series connector, B10B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py EQFP, 144 Pin (https://www.intel.com/content/dam/www/programmable/us/en/pdfs/literature/packaging/04r00476-02.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TDFN, 12 Pads, No exposed, http://www.st.com/resource/en/datasheet/stm6600.pdf TDFN, 14 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0137.PDF (T1433-2C)), generated with kicad-footprint-generator Molex LY 20 series connector, B6B-PH-K (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, SM12B-SURS-TF (http://www.jst-mfg.com/product/pdf/eng/eSUR.pdf), generated with kicad-footprint-generator.

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