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See http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 2.54mm staggered type-1 TO-220-11, Horizontal, RM 2.54mm, staggered type-2, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 1.27mm staggered type-1 TO-220-15, Horizontal, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 1.27mm MultiwattF-15 staggered type-2 TO-220-11, Vertical, RM 5.45mm, , see https://toshiba.semicon-storage.com/ap-en/design-support/package/detail.TO-3P(N).html TO-3P-3 Vertical RM 4.58mm IPAK TO-251-2, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 15.24mm 600mil 28-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 32-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 6x-dip-switch SPST KingTek_DSHP06TJ, Slide, row spacing 10.16 mm (400 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads.

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