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600mil 24-lead though-hole mounted DIP package, row spacing 10.16 mm.

• Href="https://gitea.circuitlocution.com/synth_mages/synth_tools/commit/d8deca9307af08e321f2f6168a97d7f0d7734956">d8deca9307af08e321f2f6168a97d7f0d7734956 Delete '3D Printing/AD&D 1e spell.
• 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package.

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