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Chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 494, 3.3x3.38mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g431c6.pdf ST WLCSP-49, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 495, 4.4x4.38mm, 100 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l496wg.pdf ST WLCSP-132, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 324 0.8 CSGA324 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=292, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=88, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A BGA 238 0.5 CP236 CPG236 Artix-7 BGA, 16x16 grid, 17x17mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole pin header SMD 1x23 2.54mm single row Through hole straight socket strip, 1x18, 1.27mm pitch, double rows Through hole socket strip THT 1x30 2.00mm single row Through hole socket strip SMD 2x11 2.00mm double row Through hole IDC header, 2x12, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 6.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight pin header, 2x02, 2.54mm pitch, single row Through hole pin header THT 1x31 2.00mm single row Through hole angled pin header SMD 1x15 2.54mm single row (from Kicad 4.0.7!), script generated Through hole straight socket strip, 2x06, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole pin header SMD 1x30 2.54mm single row Surface mounted socket strip THT 1x11 1.00mm single row style2 pin1 right Through hole straight pin header, 1x12, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Surface mounted pin header THT 1x32 2.54mm single row Through hole straight pin header, 1x31, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x29 2.54mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x23 1.27mm double row surface-mounted straight socket strip, 2x14, 1.27mm pitch, single row style1 pin1 left Surface mounted socket strip SMD 2x06 1.00mm double row surface-mounted straight socket strip, 2x07, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole straight socket strip, 2x22, 2.54mm pitch, 6mm pin length, double rows Through hole pin header SMD 1x20 2.54mm single row Through.

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