Labels Milestones
BackWidth 16.90 mm Power-Integrations variant of 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG SSOP20: plastic shrink small outline package; 44 leads; body width 5.3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (http://www.ti.com/lit/ds/symlink/ina3221.pdf#page=44), generated with kicad-footprint-generator Samtec.
- -0.758285 -0.622326 0.194199 facet normal -4.792339e-001 -8.386592e-001 2.588158e-001.
- Document, but changing it is.