Labels Milestones
BackVSON10 3x3mm Body, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted socket strip SMD.
- (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF DD Package; 14-Lead Plastic DFN.
- To de-bodge the pots. 6523065365c12ceda76dbda25c5041018c73eb63