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ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 483, 3.73x4.15mm, 115 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row Through hole pin header SMD 1x20 1.27mm single row Surface mounted socket strip SMD 2x35 2.00mm double row surface-mounted straight pin header, 1x21, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 2x38 2.54mm double row Through hole.

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