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BGA Texas Instruments, DSBGA, area grid, YZP, YZP0010, 1.86x1.36mm, 10 Ball, 3x4 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm http://chip.tomsk.ru/chip/chipdoc.nsf/Package/D8A64DD165C2AAD9472579400024FC41!OpenDocument VSON 10 Thermal.

• -0.633165 0.0623612 0.771501 vertex 0 -10.1139.
• Http://microrato.ua.pt/main/Actividades/Estagios/Docs/IS485_6.pdf Sharp OPIC IS485 IS486 package.

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