Labels Milestones
BackSBG484 SBV484 Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas.
- Height FFC/FPC connector, 10.
- -8.113385e-01 -5.845766e-01 -3.247329e-04 vertex -1.031007e+02 9.453586e+01 2.550000e+00 facet.
- Ethernet 8p8c transformer magjack 1 Port.
- PIC0512H Power Inductor WE-PDF Wuerth Shielded Power Inductors.