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1.403x1.555mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered.

• 0.429045 facet normal 2.488520e-001 9.685416e-001 -0.000000e+000 vertex 3.559962e+000.
• -0.22956 -0.181238 0.956271 facet normal 7.241379e-01 6.896552e-01 -0.000000e+00.
• 1.76336 9.999 facet normal -4.044963e-001 6.938726e-001 5.957547e-001.
• -0.29018 -0.0285785 0.956545 vertex.

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