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3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), Socket 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x4.1mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 4x-dip-switch SPST.

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