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236-316 45Degree pitch 5mm size 122x15mm^2 drill 1.2mm pad 2.4mm Terminal Block Phoenix PT-1,5-14-5.0-H pitch 5mm size 15x8.3mm^2 drill 1.3mm pad 2.6mm terminal block Metz Connect Type171_RT13704HBWC, 4 pins, pitch 5.08mm, size 30.5x9.8mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00078_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block Phoenix PT-1,5-15-5.0-H, 15 pins, pitch 3.5mm, size 10.5x6.5mm^2, drill diamater 1.3mm, pad diameter 3mm, see , script-generated with , script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_RND THT terminal block Metz Connect 360410 size 5x5mm^2 drill 1.5mm pad 3mm Terminal Block TE 282834-9 pitch 2.54mm 0.25W = 1/4W length 6.3mm diameter 2.5mm SMD pad rectangle square THT rectangular pad as test Point, diameter 2.0mm 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 z-position of LED center 3.0mm 2 pins Red 5381 Series LED VCCLite https://vcclite.com/wp-content/uploads/wpallimport/files/files/5381Series.pdf http://static.vcclite.com/pdf/Mounting%20Hole%20Pattern%202.pdf Red 5381 Series LED VCCLite https://vcclite.com/wp-content/uploads/wpallimport/files/files/5381Series.pdf http://static.vcclite.com/pdf/Mounting%20Hole%20Pattern%202.pdf Amber 5381 Series LED Yellow 5381 Series LED VCCLite https://vcclite.com/wp-content/uploads/wpallimport/files/files/5381Series.pdf http://static.vcclite.com/pdf/Mounting%20Hole%20Pattern%202.pdf Yellow 5381 Series LED A20 Olinuxino LIME2, 1.2GHz, 512-1024MB RAM, Micro-SD, NAND or eMMC, 1000Mbit Ethernet A20 Olimex Olinuxino LIME2 development board Common footprint for the setscrew hole in case of crashes Fix getting a bunch of wires backwards From 16055f0ae510d4466f2b156df715b3e97e4555d8 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Added hard sync input. But could also do one of the potentiometer pads and trace routing to de-bodge the pots. Updates the potentiometer pads and thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l476me.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f071v8.pdf WLCSP-63, 7x9 raster, 3.228x4.164mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, YZT, 1.86x1.36mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-225, 13.0x13.0mm, 225 Ball, 15x15 Layout, 0.8mm Pitch, https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-bga/05081600_0_bga49.pdf https://www.analog.com/media/en/technical-documentation/product-information/assembly-considerations-for-umodule-bga-lga-package.pdf BGA 324 0.8 CS324 CSG324 BGA 324 0.8 GateMate FPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 3x4 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32u575og.pdf#page=306 ST WLCSP-100, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 4.539x4.911mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=80, NSMD pad definition Appendix A BGA 400 0.8 CLG400 CL400 Zynq-7000 BGA, 15x15 grid, 13x13mm package, pitch.

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