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12x11 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A.

• -8.10352 3.26879 vertex 9.00415 -3.72964 3.26879.
• 1.79825 18.88 facet normal -0.920075 -0.0458094 0.389053.
• -1.090539e+000 2.475471e+001 facet normal.

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