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Size 45x9mm^2, drill diamater 1.3mm, pad diameter 2.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-xV 2.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 40 Pin (JEDEC MO-153 Var DB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Mounting Hardware, inside through hole lga land grid array Bosch LGA, 8 Pin (https://www.renesas.com/eu/en/www/doc/datasheet/hip2100.pdf#page=13), generated with kicad-footprint-generator Thick Film Chip Resistor Array, Wave soldering, Vishay CRA06P (see cra06p.pdf Thick Film Chip Resistor Network, ROHM MNR02 (see mnr_g.pdf Chip Resistor Network, ROHM MNR14 (see mnr_g.pdf Chip Resistor Network, ROHM MNR32 (see mnr_g.pdf Chip Resistor Network, ROHM MNR35 (see mnr_g.pdf Chip Resistor Network.

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