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SOIC 1.27 SSO, 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), LongPads 40-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil.

• 0.941529 20 vertex -5.69599 -3.1314 19.9 vertex.
• Infineon_PG-LLGA-5-1 StepUp generated footprint, http://katalog.we-online.de/pbs/datasheet/7440310047.pdf wurth wuerth smd.

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