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EuroQuartz MJ series http://cdn-reichelt.de/documents/datenblatt/B400/MJ.pdf, 5.0x3.2mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002JA https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, hand-soldering, 3.2x2.5mm^2 package crystal Epson Toyocom FA-128 (https://support.epson.biz/td/api/doc_check.php?dl=brief_FA-128⟨=en), 2x1.6mm^2 package SMD Crystal Seiko Epson MC-506 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, 11.7x4.0mm^2 package SMD Crystal Seiko Epson SG-210 https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-210SED, 2.5x2.0mm^2 package SMD Crystal 2012/2 http://txccrystal.com/images/pdf/9ht11.pdf, hand-soldering, 2.0x1.2mm^2 package SMD SMT crystal Abracon ABM10 Abracon Miniature Ceramic Smd Crystal ABM3C http://www.abracon.com/Resonators/abm3c.pdf, 5.0x3.2mm^2 package Abracon Miniature Ceramic Smd Crystal ABM10 http://www.abracon.com/Resonators/ABM10.pdf SMD SMT mems oscillator Analog BGA-49, 6.25x6.25mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 483, 3.73x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.onsemi.com/pdf/datasheet/ncp163-d.pdf#page=23 6pin Pitch 0.4mm http://www.ti.com/lit/ds/symlink/txb0108.pdf USON-20 2x4mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, DSC0010J, WSON, http://www.ti.com/lit/ds/symlink/tps61201.pdf Plastic Small Outline (SO), see https://docs.broadcom.com/docs/AV02-0173EN 4-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/84299/vor1142b4.pdf SSO Stretched SO SOIC 2.54 8-Lead Plastic SO, Exposed Die Pad (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flatpack (PF) - 14x14mm body, 9.5mm sq thermal pad (http://www.analog.com/media/en/technical-documentation/data-sheets/AD9852.pdf 80-Lead Plastic Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf 8-Lead Plastic Dual Flat, No Lead Package - 10x10x0.9 mm Body [DFN] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body (see Atmel Appnote 8826 64-Lead Plastic Quad Flat, No Lead Package (MF) - 6x5 mm Body [SOIC], see https://ac-dc.power.com/sites/default/files/product-docs/senzero_family_datasheet.pdf Power-Integrations variant of 8-lead though-hole mounted DIP package, row spacing 8.9.

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