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BackOn standard DIP-4), row spacing 7.62 mm (300 mils), see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations K Package PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (2mm x 2mm) 0.40mm pitch DDB Package; 12-Lead Plastic Micro Small Outline No-Lead 8-Lead Plastic Dual Flat, No.
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