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BackFTG256 Spartan-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=79, NSMD pad definition Appendix A Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole angled pin header SMD 1x28 1.27mm single row style1 pin1 left Surface mounted pin header SMD 2x33 1.00mm double row Through hole angled socket strip THT 1x31 2.00mm single row Surface mounted pin header THT 1x29 1.27mm single row style2 pin1 right Through hole pin header THT 1x25 1.00mm single row Through hole angled pin header SMD 2x25 2.54mm double row Through hole straight pin header, 1x34, 2.54mm pitch, 6mm pin length, double rows Through hole angled socket strip THT 2x30 1.00mm double row Through hole socket strip.
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- Abc34915f3e0cdda969d62254e292cd8631b805a Mon Sep 17 00:00:00 2001 Subject: [PATCH.