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14110213010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S16B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 32-lead plastic TSOP; Type II TSOP-II, 44 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/39935c.pdf#page=152), generated with kicad-footprint-generator JST PH series connector, 53261-0771 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator JST SUR side entry Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-139 , 9 Pins (https://www.molex.com/pdm_docs/sd/009652028_sd.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-1104, With thermal vias in pads, 5 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LGA 24L 3x3.5mm Pitch 0.43mm LGA 28 5.2x3.8mm Pitch 0.5mm USON-20 2x4mm Pitch 0.4mm http://www.chip.tomsk.ru/chip/chipdoc.nsf/Package/C67E729A4D6C883A4725793E004C8739!OpenDocument WSON-16 3.3 x 1.35mm Pitch 0.4mm 8-Lead Plastic Small Outline (SSO/Stretched SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true 6-pin plasic small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot519-1_po.pdf SSOP16.

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