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SM04B-GHS-TB (http://www.jst-mfg.com/product/pdf/eng/eGH.pdf), generated with kicad-footprint-generator JST ACH series connector, S18B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator Hirose series connector, SM02B-LEASS-TF (http://www.jst-mfg.com/product/pdf/eng/eLEA.pdf), generated with kicad-footprint-generator Hirose series connector, 14111013010xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13010XXX_100228421DRW063C.pdf), generated with kicad-footprint-generator Molex LSHM 0.50 mm Razor Beam High-Speed Hermaphroditic Terminal/Socket Strip, LSHM-110-xx.x-x-DV-N, 10 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5040, 4 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 2.5 mm² wires, reinforced insulation, conductor diameter 0.48mm, outer diameter 2mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator XP_POWER IHxxxxS SIP DCDC-Converter XP_POWER ITxxxxxS, SIP, (https://www.xppower.com/portals/0/pdfs/SF_ITX.pdf https://www.xppower.com/portals/0/pdfs/SF_ITQ.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas VSON-HR, 8 Pin (https://www.qorvo.com/products/d/da007268), generated with kicad-footprint-generator JST XA series connector, B14B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator connector Molex Mini-Fit_Jr side entryplastic_peg Molex Mini-Fit Sr. Power Connectors, 42819-62XX, 6 Pins per row (http://www.molex.com/pdm_docs/sd/428202214_sd.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-1600 (alternative finishes: 43045-022x), 1 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST XA vertical JST J2100 series connector, S2B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1010, with PCB locator, 3 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py WSON, 8 Pin (https://datasheet.lcsc.com/lcsc/2005251034_XTX-XTSD01GLGEAG_C558837.pdf#page=6), generated with kicad-footprint-generator JST EH top entry Hirose series connector, B3B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Hirose series connector, SM30B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py 4-Lead Plastic Small Outline (ST)-4.4 mm Body [UQFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack - 10x10x2.5mm Body (http://www.onsemi.com/pub/Collateral/122BK.PDF PQFP80 14x20 / QIP80E CASE 122BS (see ON Semiconductor 506CM.PDF DFN, 14 Pin (http://www.ti.com/lit/ds/symlink/tlv9004.pdf#page=64), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-104-02-xxx-DV-LC, 4 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 4 times 0.127 mm² wire, basic insulation, conductor diameter 1.25mm, outer diameter 2.3mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (JEDEC MO-153 Var EC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf), generated with kicad-footprint-generator connector Molex MicroClasp Wire-to-Board System, 55932-1230, 12 Pins (http://www.molex.com/pdm_docs/sd/903250004_sd.pdf), generated with kicad-footprint-generator Soldered wire.

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