3
1
Back

Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.5mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 18x18 grid, 15x15mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments EUK 7 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 15.24mm 600mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD DIP Switch SPST Slide 6.73mm 264mil SMD LowProfile JPin SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 7.62 mm (300 mils 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 9.78x25.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 8x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 10-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 32-lead though-hole mounted.

New Pull Request