Labels Milestones
BackOmron_A6S-210x, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 14-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 32-lead dip package, row spacing 8.61 mm (338 mils), body size 9.78x32.66mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 6.15 mm (242 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 3x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 24-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils.
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