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See http://cdn-reichelt.de/documents/datenblatt/C300/G6H%23OMR.pdf Omron G6K-2F relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2G relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2P-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2F-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2G relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2G-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2G-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2F-Y relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Omron G6K-2G relay package http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6k.pdf Relay Omron G6S-2, see http://omronfs.omron.com/en_US/ecb/products/pdf/en-g6s.pdf Fujitsh FTR B3S B3SA Relay J JLeg AXICOM HF3-Series Relay Pitch 1.27mm HSOP 11.0x15.9mm Pitch 0.65mm Slug Down Thermal Vias (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 0.65mm SSOP, 8 Pin (https://www.st.com/resource/en/datasheet/l5973d.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-125-02-xxx-DV-A, 25 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 60 Pin (JEDEC MO-194 Var AC https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP-I, 48 Pin (https://www.nxp.com/docs/en/package-information/98ASA00694D.pdf DFN8.

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