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Leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot158-1_po.pdf VSO56: plastic very small outline package; 44 leads; body width 6.1 mm; lead pitch 0.635; (see http://www.ftdichip.com/Support/Documents/DataSheets/ICs/DS_FT231X.pdf SSOP20: plastic shrink small outline package http://www.ti.com/lit/ds/symlink/drv8301.pdf HVSSOP, 10 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfn/05081644_0_LQFN10.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single.

• 0.988483 0.0979878 0.115323 vertex 3.43619 -3.13874 21.7467.
• SIP, (https://www.xppower.com/pdfs/SF_ITX.pdf), generated with kicad-footprint-generator Molex.
• 0.264256 -0.161947 0.950759 facet.
• -2.108080e-03 -9.104482e-01 vertex -1.084728e+02.

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