Labels Milestones
Back41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole angled socket strip SMD 1x08 2.00mm single row Through hole angled socket strip, 1x14, 1.27mm pitch, 4.4mm socket length, single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x12, 1.00mm pitch, double rows Through hole angled pin header, 2x31, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x02, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole angled socket strip THT 1x19 5.08mm single row Surface mounted pin header THT 1x11 2.54mm single row Through hole straight pin header, 2x10, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x07 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x21 1.27mm single row style2 pin1 right Through hole angled pin header SMD 1x23 2.00mm single row Through hole Samtec HPM power header series 3.81mm post length THT 1x14 1.27mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip, 1x40, 2.00mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script generated Through hole angled pin header THT 2x14 2.54mm double row surface-mounted straight socket strip, 2x09, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x37 2.00mm double row Through hole angled pin header THT 1x32 1.27mm single row Through hole angled socket strip, 2x43, 1.27mm pitch, 3.9x4.9mm body, exposed pad, Analog Devices (Linear Tech), 133-pin BGA uModule, 15.0x15.0x4.92mm, https://www.analog.com/media/en/technical-documentation/data-sheets/4637fc.pdf MAPBGA 9x9x1.11 PKG, 9.0x9.0mm, 272 Ball, 17x17 Layout, 0.5mm Pitch, https://ww1.microchip.com/downloads/en/DeviceDoc/16B_WLCSP_CS_C04-06036c.pdf WLCSP-20, 4x5 raster, 1.934x2.434mm package, pitch 0.4mm; http://ww1.microchip.com/downloads/en/devicedoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=208 WLCSP-16, 1.409x1.409mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g483me.pdf ST WLCSP-81, ST die ID 469, 4.02x4.27mm, 81 Ball, 9x9 Layout, 0.4mm Pitch, https://www.nxp.com/docs/en/package-information/SOT1963-1.pdf ST LFBGA-354, 16.0x16.0mm, 354 Ball, 19x19 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=263, NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch.
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