Labels Milestones
BackST WLCSP-20, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.ti.com/lit/ml/mxbg419/mxbg419.pdf, https://www.ti.com/lit/ds/symlink/tmp117.pdf Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, NSMD pad definition Appendix A BGA 1156 1 FF1156.
- 0.366853 0.924971 0.0992372 facet normal -0.0813397.
- 1.965232e-001 vertex -4.016088e+000 2.271186e+000 2.470887e+001.