3
1
Back

Body, 0.55mm pitch, IPC-calculated pads (http://ww1.microchip.com/downloads/en/devicedoc/doc0807.pdf TSOP I 32 reverse TSOP-I, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation CB), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 0.5 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 3.5mm, size 52.5x7.6mm^2, drill diamater 1.15mm, pad diameter 2.1mm, see http://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F282834%7FC1%7Fpdf%7FEnglish%7FENG_CD_282834_C1.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block Phoenix MKDS-3-7-5.08 pitch 5.08mm size 30.5x9.8mm^2 drill 1.3mm pad 2.5mm terminal block RND 205-00238, 8 pins, pitch 5mm, size.

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