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400mil 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body.

• Needed big board, requiring one 8-pin, one 14-pin.
• Diode, TO18-like (D=5.6mm), 3pin Laser Diode, TO5-like.

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